JPH0446549U - - Google Patents
Info
- Publication number
- JPH0446549U JPH0446549U JP8822990U JP8822990U JPH0446549U JP H0446549 U JPH0446549 U JP H0446549U JP 8822990 U JP8822990 U JP 8822990U JP 8822990 U JP8822990 U JP 8822990U JP H0446549 U JPH0446549 U JP H0446549U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- heat radiator
- resin coating
- fixing portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8822990U JPH0446549U (en]) | 1990-08-23 | 1990-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8822990U JPH0446549U (en]) | 1990-08-23 | 1990-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446549U true JPH0446549U (en]) | 1992-04-21 |
Family
ID=31821286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8822990U Pending JPH0446549U (en]) | 1990-08-23 | 1990-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446549U (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300545A (ja) * | 1987-05-29 | 1988-12-07 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH01268159A (ja) * | 1988-04-20 | 1989-10-25 | Nec Corp | 樹脂封止半導体装置及び成型用金型 |
-
1990
- 1990-08-23 JP JP8822990U patent/JPH0446549U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300545A (ja) * | 1987-05-29 | 1988-12-07 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH01268159A (ja) * | 1988-04-20 | 1989-10-25 | Nec Corp | 樹脂封止半導体装置及び成型用金型 |